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Flux Cleaning Agent×化研テック - List of Manufacturers, Suppliers, Companies and Products

Flux Cleaning Agent Product List

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Microclean EC-8100 / Markless ECO-R81

Excellent cleaning ability and particle removal in narrow gaps! Environmentally friendly with low VOC and non-hazardous materials.

The "Micro Cleaner EC-8100 / Markless ECO-R81" is a cleaning agent and rinse agent for the flux cleaning system "Micro Cleaner," which is essential for high-density mounting. Thanks to its innovative cleaning mechanism, it can clean flux in narrow gaps of 50μm or less. It also excels in removing difficult-to-remove particles such as tiny solder balls, grease, and fine particles. About 70% of its ingredients are composed of water, which helps reduce VOC emissions during drying processes and evaporation. Additionally, it has no flash point and is not classified as a hazardous material under fire safety laws, making it suitable for international transport as a regular product. 【Features】 ■ Excellent cleaning ability for narrow gaps and particle removal ■ Environmentally friendly with low VOC and non-hazardous ■ Continuously distilled and regenerated within the device, requiring almost no liquid replacement (Markless ECO-R81) *For more details, please refer to the PDF document or feel free to contact us.

  • Cleaning agents
  • Other consumables

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Why is flux cleaning necessary?

What problems can arise if the flux residue is not removed?

The purpose and reason for cleaning flux is to prevent the occurrence of electrical and physical troubles. The ionic components of flux residues can cause ion migration under high humidity, leading to metal deposition between electrodes and resulting in short circuits. Additionally, the presence of halogen ions under high temperature and high humidity can generate halogen compounds, causing degradation and collapse. Furthermore, if flux residues adhere to contact points such as connectors, it can lead to poor connections. 【Troubles to Prevent (Partial List)】 ■ Decreased insulation reliability ■ Corrosion ■ Poor connections ■ Leaks or shorts due to residual solder balls ■ Decreased bonding strength in wire bonding *For more details, please refer to the related links or feel free to contact us.

  • Solder
  • Printed Circuit Board

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